bl-r8188eu1（eus）
productspecification
                 wlan 11b/g/n usb module
approvalsheet
customer
date
producttype
bl-r8188eu1
part no.
blink approve field
engineer
qc
sales
customer approve field
engineer
qc
manufactory
purchasing
content
 toc o 1-3 h z ucontent. pageref _toc410027559h 1
0. revision history. pageref _toc410027560h 2
1. general description. pageref _toc410027561h 2
2. the range of applying. pageref _toc410027562h 2
3. product specification. pageref _toc410027563h 2
3.1 function block diagram.. pageref _toc410027564h 2
3.2 electrical and performance specification. pageref _toc410027565h 3
3.3 dc characteristic. pageref _toc410027566h 3
3.4 rf characteristic. pageref _toc410027567h 4
3.5 product photo. pageref _toc410027568h 5
3.6 mechanical specification. pageref _toc410027570h 5
3.7 product pin definition. pageref _toc410027571h 6
4. supported platform.. pageref _toc410027572h 7
5. peripheral schematic reference design. pageref _toc410027573h 7
6. package information. pageref _toc410027574h 8
7. typical solder reflow profile. pageref _toc410027575h 8
8. precautions for use. pageref _toc410027576h 9
0.    revisionhistory
date
document
revision
product
revision
changedescription
2014/06/18
1.0
v2.7
update format ,change product size tolerance.
1. generaldescription
bl-r8188eu1 product is designed base on realtek rtl8188euschipset .it combines cmos mac, baseband phy and rf in a single chipfor ieee 802.11/b/g/n compatible. it supports ieee802.11i safetyprotocol, along with ieee 802.11e standard service quality. itsupports the new data encryption on 64/128 bit wep and safetymechanism on wpa-psk/wpa2-psk, wpa/wpa2. it can implement thewireless network function on the laptop/desktop/mid and otherwireless devices easily . this module has implemented someefficient mechanisms in its software and hardware to maximize theperformance.
2.    the range ofapplying
mid, networking camera, stb gps, e-book, hard disk player,network radios, psp and other device which need be supported bywireless networking.
3. productspecification
3.1 function blockdiagram
3.2 electrical andperformance specification
item
description
product name
bl-r8188eu1
major chipset
rtl8188eus
host interface
usb2.0
standard
ieee 802.11b, ieee 802.11g,ieee 802.11n,
frequency range
2.4ghz~2.4835ghz
modulation type
802.11b: cck,dqpsk, dbpsk
802.11g:64-qam,16-qam, qpsk, bpsk
802.11n:64-qam,16-qam, qpsk, bpsk
working mode
infrastructure,  ad-hoc
data transfer rate
1,2,5.5,6,11,12,18,22,24,30,36,48,54,60,90,120and
maximum of 150mbps
spread spectrum
ieee 802.11b: dsss (direct sequence spreadspectrum)
ieee 802.11g/n:ofdm (orthogonal frequencydivision
multiplexing)
sensitivity @per
1m: -90dbm@8%per
6m: -88dbm@10%per 
11m:-86dbm@8%per
54m:-73dbm@10%per
135m:-68dbm@8%per
rf power（typical）
16dbm@11b, 14dbm@11g , 13dbm@11n,
antenna type
connect to the external antenna through the halfhole
the transmit distance
indoor 100m, outdoor 300m, according the localenvironment
dimension(l*w*h)
13.0 x 12.3 x 1.55mm (lxwxh) ;tolerance:+-0.2mm
power supply
3.3v +/-0.2v
power consumption
standby mode ,
tx mode
clock source
40mhz
working temperature
0°c to +50°c
storage temperature
-40°c ~ +85°c
3.3 dccharacteristic
terms
contents
specification :ieee802.11b
mode
dsss / cck
frequency
2412 –2484mhz
data rate
1, 2,5.5,11mbps
dccharacteristics
min
typ.
max.
unit
tx mode
257
263
271
ma
rxmode
80
82
84
ma
sleepmode
78
80
82
ma
specification :ieee802.11g
mode
ofdm
frequency
2412-2484mhz
data rate
6, 9, 12, 18,24, 36, 48,54mbps
dccharacteristics
min
typ.
max.
unit
tx mode
244
245
245
ma
rxmode
88
89
89
ma
sleepmode
78
80
82
ma
specification :ieee802.11n
mode
ofdm
frequency
2412-2484mhz
data rate
6.5,13,19.5,26, 39, 52,58.5,65mbps
dccharacteristics
min
typ.
max.
unit
tx mode
201
207
214
ma
rxmode
90
93
94
ma
sleepmode
78
80
82
ma
3.4 rfcharacteristic
mode
rate(mbps)
power(dbm)
evm(db)
sensitivity(dbm)
ch1
ch7
ch13
ch1
ch7
ch13
ch1
ch7
ch13
11b
1
17.43
17.36
17.20
-28.27
-28.11
-27.86
-95
-94
-94
11
17.91
17.77
17.68
-23.42
-24.02
-24.21
-86
-86
-86
11g
6
15.39
15.22
15.33
-32.02
-31.43
-31.17
-90
-90
-90
54
14.79
14.81
15.11
-33.03
-32.63
-32.31
-74
-73
-73
11n
ht20
mcs0
15.02
15.12
15.33
-32.14
-31.66
-32.88
-90
-90
-90
mcs7
14.75
14.67
14.66
-32.40
-31.29
-31.60
-70
-70
-70
mode
rate(mbps)
power(dbm)
evm(db)
sensitivity(dbm)
ch3
ch7
ch11
ch3
ch7
ch11
ch3
ch7
ch11
11n
ht40
mcs0
15.52
15.53
15.33
-32.54
-31.47
-32.49
-88
-88
-88
mcs7
14.65
14.6
14.76
-32.51
-31.39
-31.92
-68
-68
-68
3.5 product photo
            top                                        bottom
3.6 mechanicalspecification
 module dimension: typical (l x w x h):13mmx12.3mmx1.55mm   tolerance : +/-0.2mm
3.7 product pindefinition
4. supportedplatform
operatingsystem
cpuframework
driver
win2000/xp/vista/win7
x86platform
enable
linux2.4/2.6
arm,mipsii
enable
wince5.0/6.0
arm,mipsii
enable
5. peripheral schematicreference design
6. packageinformation
7. typical solderreflow profile
8. precautions for use
1. pls handle the module underesd protection.
2.reflow soldering shall be done according to the solder reflowprofile. peak temperature
245℃.
3.products require baking before mounting if humidity indicatorcards reads >30% temp <30 degree c, humidity < 70% rh,over 96 hours.
baking condition: 125 degreec, 12 hours
baking times: 1time
4. storagecondition: moisture barrier bag must be stored under 30 degree c,humidity under 85% rh. the calculated shelf life for the dry packedproduct shall be a 12 months from the bag seal date. humidityindicator cards must be blue, <30%.

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