苏州佳士华贸易有限公司长期供日本千住锡膏(m705-grn360-k2-v / m705-grn360-k2 / m705-grn360-l60c / m705-plg-32-11) ； 千住无卤锡膏(m705-shf / s70g-hf) ;美国阿尔法锡膏( om310/om338 /om325/om338pt/om338pt/om338t45/om340/om340uv/om350/ws619/ws819/ws820/cvp520 /om5000/om5002/om5100/ol-107e / up78)；美国阿尔法助焊剂(rf800\rf800t\rf800t3\rf800ns\ef2210\ef3215\ef6100\ef6100p\ef6100r\ef6000\ef8000\ef8000gl\ef9301\ef10000\ef12000\nr330\nr205\nr310b\nr310h\ws856\ws857\ws859\ws9132\260f\260hf\265hf\310s\320a\3355-11\3355hb\3355vf\550ht\615\ls500a\sls23f\sls10w\sls25f\sls56f\sls27f\sls60\sls65\sls65c\sls65h) ；阿尔法清洗剂（2110\926\2002d\2007\2444\autoclean40\bc-2200\bc-2400\bc-3300\sc7525\sc-30\sm110\sm110e\sm440\2001p\2003\e-2001\e-2001a\e-2001ws\e2001sc\ec-15\ec-7r\sc-10\sc-10e\）；阿尔法助焊膏（up78\lr725\om338\om340\7lv\9lv）;阿尔法稀释剂（rf800add\373add\425\3355-11add\）tamura锡膏(tlf-204-111/tlf-204-93/tlf-204-19a/tlf-204-85/tlf-204-49/tlf-204-mds/rma-010-fp)； tamura无卤锡膏（tlf-204-nh）；日本koki锡膏（s3x48-m406-3系列/ s3x58 -m406-3/s3x58-m650-3/s3x48-m650-3/s3x58-650/s3x58-650-3/s3x58-kv40/s3x58-m405 /s3x58-m405-2系列/s3x58-m406d/s3x58-m406系列/se4-m953/se48-m600-3c/se48-m955/se48-1000-3/se48-m9555lv/se58-m405l-2/se48-m954-2)；日本阿米特almit锡膏 （lfm-48w tm-hp / lfm-48w tm-ts / lfm-48w tm/lfm-48wnh(d)/ssna-sj.s;kester锡膏（909hps/em918ap/ em923ap）；减摩锡膏（np303-cqs-1/np303-cqs-2/np303-gm755/np303-gm855-gk/np303-ld155-gq/np303-mf155-gq/np303-cqs-1h）；日本富士红胶(fuji sealglue)(ne8800k / ne8800t / ne3000s / 200gr、40gr、30gr、20gr)； 德国乐泰红胶(3611 / 3609) ；德国贺利氏黄胶（pd955py /pd945m）;德邦胶水；优耐特胶水；贝迪标签；艾利不干胶标签；国产助焊剂和清洗剂。 如有需要了解产品或取得相关资料请垂询
alpha无铅免洗锡膏om338t45无铅锡膏
ultra fine feature lead-free solder paste
description
alpha om-338-t45 is a lead-free, no-clean solder paste designed for a broad range of applications. alpha om-338-t45’s broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste. this material is engineered to deliver the comparable performance to a tin lead process.* alpha om-338-t45 yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability and high “through-put” applications.
outstanding reflow process window delivers good soldering on cuosp with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. alpha om-338-t45 is formulated to deliver excellent visual joint cosmetics. additionally, alpha om-338-t45’s capability of ipc class iii for voiding and rol0 ipc classifications ensures maximum long-term product reliability.
*although the appearance of these lead-free alloys will be different to that of tin-lead, with mechanical reliability equal to or greater than with that of tin-lead or tin-lead-silver.
features & benefits
maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as 0.25mm (0.010”) with 0.100mm (4mil) stencil thickness.
excellent print consistency with high process capability index across all board designs.
print speeds of up to 200mm/sec (8”/sec), enabling a fast print cycle time and a high throughput.
wide reflow profile window with good solderability on various board / component finishes.
excellent solder and flux cosmetics after reflow soldering
reduction in random solderballing levels, minimizing rework and increasing first time yield
meets highest ipc 7095 voiding performance classification of class iii.
excellent reliability properties, halide-free material
compatible with either nitrogen or air reflow
product information
alloys: sac405 (95.5%sn/4.0%ag/0.5%cu)
powder size: type 4.5
residues: approximately 5% by (w/w)
packaging sizes: 500 gram jars,
lead free: complies with rohs directive 2002/95/ec.
application
formulated for both standard and fine pitch stencil printing, at print speeds of between 25mm/sec (1”/sec) and 200mm/sec (8”/sec), with stencil thickness of 0.100mm (0.004”) to 0.150mm (0.006”), particularly when used in conjunction with alpha® stencils. blade pressures should be 0.16-0.34 kg/cm of blade (0.9 -2ibs/inch), depending upon the print speed. the higher the print speed employed, the higher the blade pressure that is required. the reflow process window will give high soldering yield with good cosmetics and minimized rework.

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苏州佳士华贸易有限公司
李林雄
18936092951
苏州新区馨泰花苑商业房6幢1A室