ceramic substrates, ceramic circuit boards, aluminium nitride substrates, aluminium oxide substrates processing, line width and spacing canreach50μm. 
       sun yat-sen university electronic packaging electrochemistry lab, our processing techniques come from space technology.
        tel: 13560428875
to microelectronics companies, we adopt dpc technology to process ceramic circuits, meeting their demands for mass production of the ceramic circuits.toscientific research institutions, we provide the required chemicals for ceramic circuits processing. to researchers, we provide the services of magnetron sputtering, film andelectroplatingprocessing.
the following is a brief introduction to 5050 standard edition, with sample pictures:
alumina purity is 96%, material plate thickness is 0.5mm, copper plating thickness is 65±15μm.
the color of solder-resist ink is optional, you can choose double-sided white or green. immersion silver thickness is 0.2-0.4μm.
plating layers on side a
        the first layer: material: ti; thickness: 0.1μm;
        the second layer: material: cu; thickness: 65±10μm
        the third layer: material: ag; thickness: 0.2-0.5μm
plating layers on side b
        the first layer: material: ti; thickness: 0.1μm;
        the second layer: material: cu; thickness: 65±10μm
        the third layer: material: ag; thickness: 0.2-0.5μm
solder-resist ink: white or green
        thickness of solder-resist ink on side a: 10-13μm
        thickness of solder-resist ink on side b: 10-20μm
hole cut copper plating, apertures are 53μm, 100μm, 53μm
        size: 109.2mm*54.5mm/210pcs
陶瓷基板，陶瓷线路板，氮化铝基板，氧化铝基板加工，线距线宽精度可以达到50微米，中山大学电子封装电化学实验室，加工工艺源于航空科技。联系电话：13560428875
面向微电子公司，采用dpc技术加工陶瓷电路。解决客户陶瓷电路量产订单的加需求。
        面向科研院校提供陶瓷电路加工所需化学品。为研究者提供磁控溅射、菲林和电镀加工服务。
以下是5050标准版的介绍，及生产线样片实拍照片：
氧化铝纯度96%，材料板厚0.5mm，镀铜厚度65±15μm，可选双面白色或者绿色阻焊油墨，沉银0.2-0.4μm。
a面镀层情况
        镀层层数：第一层  材料种类：钛  厚度：0.1μm
        镀层层数：第二层  材料种类：铜  厚度：65±10μm
        镀层层数：第三层  材料种类：银  厚度：0.2-0.5μm
        b面镀层情况
        镀层层数：第一层  材料种类：钛  厚度：0.1μm
        镀层层数：第二层  材料种类：铜  厚度：65±10μm
        镀层层数：第三层  材料种类：银  厚度：0.2-0.5μm
阻焊油墨：可选白色，绿色
        a面阻焊油墨厚度：10-13μm
        b面阻焊油墨厚度：10-20μm
通孔镀铜，孔径53μm 100μm 53μm
        整片规格109.2mm*54.5mm/210pcs
样片实拍照片：

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广州瀚吉传感科技有限公司
劳武江
15013319966
中山大学国家科技园A座1001